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12 articles for “power dissipation”
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Design and Implementation of Low Power and Area Efficient Sub Threshold Level Shifter Using 16 nm CMOS Technology
Abstract: An efficient method of modifying subthreshold voltages is proposed here. As an alternative to static power dissipation, the suggested design allows for charging of internal nodes through VDDH. The force of the pull-down mechanism may be increased by connecting a second auxiliary circuit. The transition energy for input frequencies between 1 and 5 MHz is 84 fJ, the propagation delay is 46 ns, the dynamic power dissipation is 0.3 mW, …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 1, Issue 1, 2023 · pp. 16–24 Read article
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Design and Simulation of Low-power, High-speed Effective Area Mux Based One-bit Full Adder Using CMOS Technology
Abstract: Our findings reveal a novel kind of circuit capable of performing both XOR and XNOR operations in parallel. Power dissipation and delay are both greatly reduced in the proposed circuits due to their low output capacitance as well as minimal short-circuit power dissipation. We show six new hybrid 1-bit full-adder (FA) circuits that take use of the XOR-XNOR or XOR/XNOR gates' special full-swing function. Each potential circuit layout has both …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 1, Issue 1, 2023 · pp. 25–33 Read article
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Spintronic Logic Device Modeling and Energy Optimization for Beyond-CMOS Computing Systems
Abstract: The continuous scaling limitations of conventional CMOS technology have accelerated the exploration of alternative computing paradigms for next-generation low-power and high-performance systems. Spintronic logic devices have emerged as a promising solution due to their non-volatility, ultra-low switching energy, high integration density, and compatibility with beyond-CMOS architectures. This research presents a comprehensive modeling and energy optimization framework for spintronic logic devices applied in beyond- CMOS computing systems. The proposed work investigates …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 4, Issue 1, 2026 Read article
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Implementation of Adders Using Ternary Based Multiple Valued Logic
Abstract: In today’s world VLSI chips are widely used in various branches of Engineering like Voice and Data communication networks, Digital signal processing, Computers, Commercial Electronics, Automobiles, Medicine and many more. So, there have been major advances in IC technology which have both made feasible and generated great interest in electronic circuits which employ more than two discrete levels of signals such circuits called Multiple valued logic circuits, offer several potential …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 1, Issue 2, 2023 · pp. 1–8 Read article
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Deep Learning-Based Thermal Prediction Models for Solid-State Electronic Devices
Abstract: The rapid advancement of solid-state electronic devices in high-performance computing, communication systems, automotive electronics, and renewable energy applications has significantly increased concerns related to thermal management and device reliability. Excessive heat generation in semiconductor devices adversely affects operational efficiency, switching performance, lifespan, and overall system stability. Traditional thermal prediction methods often require complex numerical computations and extensive simulation time, making them less suitable for real-time monitoring and adaptive control applications. …
Published in International Journal of Solid State Innovations & Research · Vol. 4, Issue 1, 2026 Read article
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Photonic-Assisted Spintronic Solid-State Switching Model for High-Speed Memory Devices
Abstract: The rapid advancement of high-speed computing and data-centric applications has intensified the demand for energy-efficient and ultra-fast memory technologies. This paper proposes a Photonic-Assisted Spintronic Solid-State Switching Model for next-generation high-speed memory devices. The proposed framework integrates photonic excitation mechanisms with spintronic switching dynamics to enhance data transfer speed, minimize switching delay, and reduce power dissipation in solid-state memory architectures. By combining optical pulse-assisted spin polarization with magnetic tunnel junction-based …
Published in International Journal of Solid State Innovations & Research · Vol. 4, Issue 1, 2026 Read article
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The Next Era of Solid-State Innovation: Beyond Silicon
Abstract: The semiconductor industry is getting close to the physical and economic boundaries of silicon-based technology. A new era of solid-state innovation is beginning. Beyond Silicon: The Next Era of Solid-State Innovation looks at the materials, device layouts, and manufacturing methods that are about to change the way electronics and energy work. The article talks about improvements in wide- and ultra-wide-bandgap semiconductors, two- dimensional materials, and quantum and neuromorphic systems that …
Published in International Journal of Solid State Innovations & Research · Vol. 3, Issue 2, 2025 · pp. 19–23 Read article
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VLSI – Power, Expansion and Versatility
Abstract: The evolution of Very Large-Scale Integration (VLSI) technology has significantly transformed the landscape of modern electronics, driving innovations across diverse industries. This article explores the key attributes of VLSI, focusing on its power, expansion, and versatility. VLSI's power lies in its ability to integrate thousands to millions of transistors on a single chip, enabling the development of high-performance, energy-efficient devices. The expansion of VLSI technology is exemplified by its application …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 3, Issue 1, 2025 · pp. 1–8 Read article
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Advancements and Challenges in Computer Hardware Technology Management: Innovations, Performance, and Future Directions
Abstract: Modern computing systems depend on computer hardware technology for performance, efficiency, and innovation. Processing units, memory storage, input/output devices, and networking hardware are covered in this article. It emphasizes how multi-core processors, SSDs, and integrated circuits have increased computational power and speed. The essay also discusses quantum computing, edge computing, and the IoT, which will change hardware. Finally, the essay discusses hardware design challenges such power consumption, heat control, and …
Published in International Journal of Solid State Innovations & Research · Vol. 3, Issue 1, 2025 · pp. 1–8 Read article
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Thermal Effects in High-Power Laser Systems: Modeling and Mitigation
Abstract: High-power laser systems are increasingly employed in industrial manufacturing, defense, medical procedures, and scientific research due to their ability to deliver high energy density with excellent spatial coherence. However, the performance and reliability of these systems are significantly influenced by thermal effects arising from optical absorption, non-radiative recombination, and inefficient heat dissipation within laser gain media and optical components. These thermal phenomena lead to adverse effects such as thermal lensing, …
Published in International Journal of Manufacturing and Production Engineering · Vol. 3, Issue 2, 2025 · pp. 9–13 Read article
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Thermodynamic Optimization and Exergy-Based Performance Analysis of Hybrid Thermal Management Systems for Electric Vehicles
Abstract: The transition toward sustainable transportation has brought electric vehicles (EVs) to the forefront of modern engineering innovation. Despite their environmental benefits and improved energy efficiency, EVs face major thermal challenges that affect performance, safety, and durability. Efficient thermal management of batteries, power electronics, and electric drive systems is vital to ensure reliability under diverse operating conditions. This study presents a detailed thermodynamic optimization and exergy-based performance analysis of hybrid thermal …
Published in International Journal of Energy and Thermal Applications · Vol. 3, Issue 2, 2025 · pp. 19–23 Read article
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Phase – Field Modeling of Brittle and Ductile Fracture Under Complex Loading Conditions
Abstract: Phase-field modeling has emerged as a powerful computational framework for predicting fracture behavior in engineering materials, offering a unified description of crack initiation, propagation, branching, and coalescence without the need for explicit crack tracking. This study presents an in-depth examination of phase-field modeling applied to both brittle and ductile fracture under complex loading conditions, including multiaxial stress states, cyclic loading, thermal gradients, and dynamic impact. The phase-field approach regularizes the …
Published in International Journal of Fracture Mechanics and Damage Science · Vol. 3, Issue 2, 2025 · pp. 13–18 Read article