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13 articles for “energy-dissipating devices”
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Seismic Analysis of G+30 RCC Frmaed Structure and Use of R.C Jacketing
Abstract: In high-rise buildings, such as G+30 reinforced concrete (RCC) framed structures, key concerns during seismic events include maintaining structural integrity, preventing catastrophic collapse, and ensuring the safety of occupants. Seismic retrofitting is a vital process aimed at enhancing the resilience of such buildings and infrastructure against earthquake forces, by strengthening their ability to withstand seismic activity. This abstract provides an overview of numerous seismic retrofitting projects implemented worldwide, focusing on …
Published in Recent Trends in Civil Engineering & Technology · Vol. 14, Issue 3, 2024 · pp. 20–37 Read article
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Seismic-Resilient Structural Systems: Geotechnical Engineering
Abstract: Earthquakes represent one of the most destructive natural hazards, capable of causing severe structural damage, loss of life, and substantial economic disruption. Seismic waves propagating through the ground can induce excessive forces and deformations in buildings, often leading to partial or complete collapse. Statistical records indicate that thousands of earthquakes occur globally each year, including several major events that result in significant damage. Past earthquake disasters have repeatedly demonstrated that …
Published in Journal of Geotechnical Engineering · Vol. 13, Issue 1, 2026 · pp. 55–63 Read article
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Spintronic Logic Device Modeling and Energy Optimization for Beyond-CMOS Computing Systems
Abstract: The continuous scaling limitations of conventional CMOS technology have accelerated the exploration of alternative computing paradigms for next-generation low-power and high-performance systems. Spintronic logic devices have emerged as a promising solution due to their non-volatility, ultra-low switching energy, high integration density, and compatibility with beyond-CMOS architectures. This research presents a comprehensive modeling and energy optimization framework for spintronic logic devices applied in beyond- CMOS computing systems. The proposed work investigates …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 4, Issue 1, 2026 Read article
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Energy-Efficient Thermal Management: Advanced Cooling Techniques for Electronics, Automotive, and Aerospace Applications
Abstract: The growing demand for energy-efficient systems across diverse industrial sectors, including electronics, automotive, aerospace, and renewable energy, has elevated the importance of advanced thermal management techniques. Effective heat dissipation is critical not only for maintaining optimal operating conditions in electronic devices but also for enhancing the performance and reliability of broader energy and mechanical systems. Inadequate thermal management can compromise energy efficiency, reduce component lifespan, and increase environmental impact. This …
Published in International Journal of Energy and Thermal Applications · Vol. 3, Issue 1, 2025 · pp. 18–23 Read article
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Captive Energy Generation by Using Gym Equipment
Abstract: This project aims to create a sustainable energy source by converting exercise equipment into devices capable of generating electrical power. Traditionally, the mechanical energy produced during workouts is wasted as it dissipates within exercise machines. This project aims to capture and convert that otherwise unused energy into usable electricity. By integrating an alternator-based system into fitness equipment, the mechanical motion generated by users during exercise can be transformed into electrical …
Published in Journal of Microwave Engineering and Technologies · Vol. 12, Issue 3, 2025 · pp. 21–26 Read article
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Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems
Abstract: The increasing complexity of next-generation embedded systems has intensified the challenges associated with power dissipation, thermal instability, signal integrity, and interconnect reliability in Very Large- Scale Integration (VLSI) architectures. This research proposes a thermally adaptive bio-inspired VLSI interconnect model designed to enhance communication efficiency and thermal resilience in advanced embedded platforms. The proposed model integrates bio-inspired adaptive routing principles with dynamic thermal-aware interconnect management to optimize data transmission under varying …
Published in Journal of VLSI Design Tools and Technology · Vol. 16, Issue 2, 2026 Read article
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Photonic-Assisted Spintronic Solid-State Switching Model for High-Speed Memory Devices
Abstract: The rapid advancement of high-speed computing and data-centric applications has intensified the demand for energy-efficient and ultra-fast memory technologies. This paper proposes a Photonic-Assisted Spintronic Solid-State Switching Model for next-generation high-speed memory devices. The proposed framework integrates photonic excitation mechanisms with spintronic switching dynamics to enhance data transfer speed, minimize switching delay, and reduce power dissipation in solid-state memory architectures. By combining optical pulse-assisted spin polarization with magnetic tunnel junction-based …
Published in International Journal of Solid State Innovations & Research · Vol. 4, Issue 1, 2026 Read article
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VLSI – Power, Expansion and Versatility
Abstract: The evolution of Very Large-Scale Integration (VLSI) technology has significantly transformed the landscape of modern electronics, driving innovations across diverse industries. This article explores the key attributes of VLSI, focusing on its power, expansion, and versatility. VLSI's power lies in its ability to integrate thousands to millions of transistors on a single chip, enabling the development of high-performance, energy-efficient devices. The expansion of VLSI technology is exemplified by its application …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 3, Issue 1, 2025 · pp. 1–8 Read article
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The Next Era of Solid-State Innovation: Beyond Silicon
Abstract: The semiconductor industry is getting close to the physical and economic boundaries of silicon-based technology. A new era of solid-state innovation is beginning. Beyond Silicon: The Next Era of Solid-State Innovation looks at the materials, device layouts, and manufacturing methods that are about to change the way electronics and energy work. The article talks about improvements in wide- and ultra-wide-bandgap semiconductors, two- dimensional materials, and quantum and neuromorphic systems that …
Published in International Journal of Solid State Innovations & Research · Vol. 3, Issue 2, 2025 · pp. 19–23 Read article
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Deep Learning-Based Thermal Prediction Models for Solid-State Electronic Devices
Abstract: The rapid advancement of solid-state electronic devices in high-performance computing, communication systems, automotive electronics, and renewable energy applications has significantly increased concerns related to thermal management and device reliability. Excessive heat generation in semiconductor devices adversely affects operational efficiency, switching performance, lifespan, and overall system stability. Traditional thermal prediction methods often require complex numerical computations and extensive simulation time, making them less suitable for real-time monitoring and adaptive control applications. …
Published in International Journal of Solid State Innovations & Research · Vol. 4, Issue 1, 2026 Read article
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Development of Polymer Based SRAM Cell with Enhance Low Power Performance
Abstract: Low-power memory technologies are in high demand with the rapid growth of portable electronics and energy-efficient computing systems. Static random-access memory (SRAM) plays a crucial role in processors, cache memories, and system-on-chip applications due to their speed and reliability. Static Random Access Memory (SRAM) is typically implemented using complementary MOS (CMOS) technology, which integrates both PMOS (P-channel Metal–Oxide–Semiconductor) and NMOS (N-channel Metal–Oxide–Semiconductor) transistors. However, as technology scales to deep submicron …
Published in Journal of Polymer & Composites · Vol. 14, Issue 1, 2026 · pp. 1439–1448 Read article
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Fractional Calculus-Based Analysis of Magneto-Thermal Nanofluid Flow Over Stretching and Shrinking Surfaces
Abstract: This study presents a comprehensive investigation of magneto-thermal hybrid nanofluid flow over stretching and shrinking surfaces using a fractional calculus framework to capture the memory and hereditary characteristics of complex fluid transport phenomena. The proposed model incorporates the effects of magnetic field intensity, thermal radiation, viscous dissipation, Brownian motion, and thermophoretic diffusion on the velocity and temperature distributions within the boundary layer region. A fractional-order derivative formulation is employed to …
Published in Recent Trends in Fluid Mechanics · Vol. 13, Issue 2, 2026 Read article
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Recent Innovations in Semiconductor Materials for Smart Electronic Devices
Abstract: Recent advancements in semiconductor materials have significantly transformed the design, performance, and functionality of smart electronic devices such as smartphones, wearable systems, IoT devices, autonomous systems, and biomedical electronics. With the continuous demand for higher processing speed, lower power consumption, improved thermal stability, and extreme miniaturization, traditional silicon-based semiconductor technology is facing major limitations. As device dimensions shrink to the nanometer scale, challenges such as leakage current, heat dissipation, and …
Published in Journal of Semiconductor Devices and Circuits · Vol. 13, Issue 2, 2026 Read article