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54 articles for “MOSFET devices.”
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Impact of Source/Drain Engineering on Performance of Single Gate and Dual Gate Junctionless MOSFET
Abstract: Abstract: This letter is the study on impact of source/drain engineering on Single Gate (SG) and Dual Gate (DG) Junctionless MOSFET. Both the proposed MOSFET have Gate Stacking and highly doped source/drain region, so name suggested is Highly Doped Source Drain Gate Stack Junctionless (HDSD-GSJL) MOSFET. Here we investigate the effect of highly doped source/drain, gate stacking and double gate on junctionless MOSFET. The investigation is performed in relations of …
Published in Journal of Semiconductor Devices and Circuits · Vol. 6, Issue 1, 2019 · pp. 10–14 Read article
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A Two-Dimensional (2D) Analytical Model for Channel Potential and Threshold Voltage of Short Channel Triple Material Gate-Double Halo (TMG-DH) DG MOSFET
Abstract: In the present paper, an analytical model for the channel potential of short channel Triple Material Gate-Double Halo (TMG-DH) DG MOSFET has been presented using parabolic approximation method. Further, the threshold voltage of the device has been calculated using minimum mid channel potential and the result obtained has been compared with the threshold voltage of Triple Material double gate (TMDG) MOSFET in order to show the improvement in the threshold …
Published in Journal of Microelectronics and Solid State Devices · Vol. 6, Issue 2, 2019 · pp. 13–25 Read article
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Recent Development in Ga2O3 MOSFETs for High Power RF Applications
Abstract: Abstract: This paper attempts to investigate the property of recently reported gallium oxide as a high power RF device by studying its related high power RF characteristics, and suggest a path to develop metal-oxide-semiconductor field effect transistor (MOSFET). Keywords: MOSFETs, Wide Band Gap Semiconductors, Gallium Oxide and RF ICsCite this ArticleNarendra Yadava, R.K Chauhan. Recent Development in Ga2O3 MOSFETs for High Power RF Applications. Journal of Semiconductor Devices and Circuits …
Published in Journal of Semiconductor Devices and Circuits · Vol. 6, Issue 1, 2019 · pp. 21–25 Read article
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3D Simulation of Multi-Gate Mosfet Analysis for Analog Circuit Design Parameters
Abstract: Chip density and performance improvements of semiconductor devices have been driven by their aggressive scaling. The performance of multi-gate FET for analog applications is explored in this paper. Analog operation of CMOS devices and its parameters are very important for future cutting edge technologies. The multi-gate technology shows excellent scalability and better immunity to short channel effects in MOSFETs. They are being easily assessed for CMOS applications beyond the 45 …
Published in Journal of Semiconductor Devices and Circuits · Vol. 1, Issue 2, 2014 · pp. 1–8 Read article
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Virtual Fabrication and Analog Performance of Sub-40nm Bulk MOSFET
Abstract: Virtual Fabrication of sub-40nm Bulk MOSFET is carried out under channel engineering and source drain engineering process. These structures enable more aggressive device scaling in nano-scale region because of their ability to control short channel effects. How ever during scaling the junction depth should also be scaled down, which increases parasitic resistance so silicidation technique has been applied to reduce their effects on device. Analog performance has been measured in …
Published in Journal of Electronic Design Technology · Vol. 1, Issue 1-3, 2011 · pp. 34–40 Read article
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MOS Capacitor: A Processing Tool
Abstract: In this modern world of technology, life without electronics is unimaginable. We are now living in the age of electronics. It is hard to find an electrical item in your home that does not have electronics part in it. The electronic devices give better efficiency and reliability in terms of power loss, speed and cost; the fundamental component of each Integrated Circuit (IC) chip, namely the MOSFET (metal oxide semiconductor …
Published in Journal of Semiconductor Devices and Circuits · Vol. 5, Issue 1, 2018 · pp. 27–32 Read article
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Investigation and Dependency Analysis of Silicon Film Thickness on Performance of Surrounding Gate MOSFET at Subthreshold Regime
Abstract: The characteristics of cylindrical gate all around MOSFET have been studied in terms of the dependence of various device performance metrics on silicon film thickness (Tsi). In this work, the effect of silicon film thickness on numerous performance metrics like threshold voltage (Vt), On current (Ion), subthreshold leakage current (Ioff), On-Off current ratio (Ion/Ioff) and DIBL of cylindrical GAA are comprehensively evaluated and analysed. It has been observed that cylindrical …
Published in Journal of VLSI Design Tools and Technology · Vol. 8, Issue 2, 2018 · pp. 49–54 Read article
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Influence of Graded Channel on Performance of Symmetric Double Material Gate Insulator FDSOI MOSFET
Abstract: Abstract: In this paper, we investigate the effect on the linearity, analog and RF performance of graded channel in case of hetero-gate-dielectric FDSOI MOSFET with higher doping at source end and low doping at drain end. The major figure of merits (FOMs) studied are on-state drive current (ION), transconductance (gm), total gate capacitance (Cgg), cut-off frequency (fT), higher order derivative of transconductance (gm’, gm’’), intermodulation distortion (IMD3) and third- order …
Published in Journal of Microelectronics and Solid State Devices · Vol. 6, Issue 1, 2019 · pp. 12–17 Read article
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Design and Optimization of Nano scale Double Gate SOI-MOSFET for Analog Applications Using SILVACO TCAD
Abstract: In this paper the structure effect on electrical characteristics of 60-nm double-gate Silicon-on-Insulator Metal-Oxide-Semiconductor Field Effect Transistor (DG-SOI-MOSFETs) is explored. These structures enable more aggressive device scaling in nano scale region because of their ability to control short channel effects. Established a scaling theory which gives guidance for the device optimization (Silicon film thickness Tsi (20nm); gate oxide thickness Tox (3nm); buried oxide thickness Tbox (200nm) and gate length LG …
Published in Journal of Electronic Design Technology · Vol. 1, Issue 1-3, 2011 · pp. 7–17 Read article
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Analysis of VLSI Circuits Designed with Single and Dual Channel Strained Silicon MOSFETs in Nanoregime
Abstract: In this paper, performance of the VLSI circuits designed with strained silicon MOSFETs is analysed andcompared with bulk MOSFET. Emphasis is being given on the evaluation of speed, power and noisecharacteristics. An inverter circuit designed with single channel and dual channel biaxial strained MOSFETsof 40 nm channel length and 0.3 germanium mole-fraction is being taken to evaluate the performance throughsimulation. The device design and circuit simulation is done in Sentaurus …
Published in Journal of VLSI Design Tools and Technology · Vol. 1, Issue 1-2-3, 2011 · pp. 15–20 Read article
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Unified Mathematical Framework for Semiconductor Devices, Junction Dynamics, and Circuit Analysis
Abstract: Semiconductor devices form the fundamental building blocks of modern electronic and integrated circuit systems, where their electrical behavior is governed by coupled carrier transport, electrostatic, and circuit-level phenomena. This work presents a unified mathematical framework for modeling semiconductor devices, junction dynamics, and their interaction with electronic circuits. The formulation integrates fundamental semiconductor relations, carrier concentration, drift–diffusion transport, Poisson’s equation, continuity equations, PN-junction behavior, diode characteristics, bipolar junction transistor operation, and …
Published in Journal of Semiconductor Devices and Circuits · Vol. 13, Issue 2, 2026 · pp. 37–47 Read article
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A Circuit Approach for CMOS VLSI Circuit Leakage Power Reduction
Abstract: Despite the fact that scaling CMOS technology boosted speed, leakage currents always remained an issue. The issue has gotten worse as the scaling has gone into the UDSM (ultra-deep-submicron) range. In order for the circuit to function effectively, these unwanted leakage currents must be reduced to a minimum. It is challenging to create these leakage-free nano-scale CMOS circuits. In this work, the issue of leakage power is addressed, which occurs …
Published in Research & Reviews: A Journal of Embedded System & Applications · Vol. 10, Issue 3, 2022 · pp. 7–18 Read article
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Review Paper: Low Power SRAM Cell using FinFET Technology
Abstract: To make portable battery operated devices more efficient with low leakage current has become a major challenge with the technology scaling. As the technology is scaling, the bulk MOSFET faces various challenges which lead to increased leakage current. FinFET is the most encouraging substitute to bulk CMOS, because of the reduced short channel effect. The FinFET device based circuits portrays advantages with its better control over the device channel and …
Published in Journal of VLSI Design Tools and Technology · Vol. 8, Issue 1, 2018 · pp. 43–47 Read article
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An Overview on MOSFET based Sensor Design
Abstract: In the past two decades the MOSFET has transformed from a simple switch in digital logic to an analog powerhouse that can be cofabricated with the sensing material on a single chip. MetalOxideSemiconductor FieldEffect Transistors (MOSFETs) have silently become the beating heart of modern sensor platforms, translating the faint whispers of physical, chemical, and biological phenomena into robust electrical signatures. This abstract surveys the latest advances that have turned the …
Published in Journal of Microelectronics and Solid State Devices · Vol. 13, Issue 1, 2026 · pp. 20–26 Read article
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Performance Analysis of 3T DRAM Using FinFET Based with Leakage Reduction Techniques at 45 nm Technology
Abstract: The proposed area of research is to reduce the power consumption, leakage voltage, leakage current and leakage power of DRAM while maintaining the competitive performance. The Fin FET approach is used in DRAM for high performance. Fin type field effect transistors (Fin FET) are capable substitutes for bulk CMOS at the nano-scale. Fin FET are double gate device. A Fin FET uses an intrinsic body. It greatly suppresses the device-performance …
Published in Journal of VLSI Design Tools and Technology · Vol. 7, Issue 3, 2017 · pp. 28–34 Read article
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Performance Analysis of 3T DRAM Using FinFET Based with Leakage Reduction Techniques at 45 nm Technology
Abstract: The proposed area of research is to reduce the power consumption, leakage voltage, leakage current and leakage power of DRAM while maintaining the competitive performance. The Fin FET approach is used in DRAM for high performance. Fin type field effect transistors (Fin FET) are capable substitutes for bulk CMOS at the nano-scale. Fin FET are double gate device. A Fin FET uses an intrinsic body. It greatly suppresses the device-performance …
Published in Journal of VLSI Design Tools and Technology · Vol. 7, Issue 2, 2017 · pp. 28–34 Read article
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Layout Design, Fabrication and Characterization of n-Channel MOSFET
Abstract: Primary force behind evolution of semiconductor industry is MOSFET, after its first IC based experimental demonstration in 1960s. It is fundamental working unit of most of the electronic circuits like cells in living being. Number of devices on a single chip has been increased with rapid phase with evolution of new technology of materials. Today there are more than 4 billion transistors are there on a single chip with effective …
Published in Journal of VLSI Design Tools and Technology · Vol. 6, Issue 2, 2016 · pp. 13–18 Read article
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A Dual Material Control Gate Tunnel Field Effect Transistor for an Asymmetric Doping at Source and Drain Regions
Abstract: Double-Gate tunnel FET devices, which uses high-κ gate dielectric, are explored using realistic design parameters, showing an ON-current as high as 0.23 mA, a gate voltage of 1.8 V, an OFF-current of not more than 1 fA (neglecting gate leakage), an improved ordinary subthreshold swing of 57 mV/dec, and a lower point slope of 11 mV/dec. A dual material control gate tunnel field effect transistor for an asymmetric doping at …
Published in Journal of VLSI Design Tools and Technology · Vol. 8, Issue 3, 2018 · pp. 45–53 Read article
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Solid State Technology Reinvents Microwave Heating
Abstract: Since magnetrons first came into widespread commercial use in microwave ovens in the early 1970s solid state technology has evolved relatively slowly to be used in industrial heating, consumer cooking, drying, automotive applications etc. Recently, RF energy utilizing solid state devices has appeared in the market as a viable replacement for magnetrons as the heating engine. This route offers many advantages like better energy direction control, longer life, enhanced reliability, …
Published in Journal of Microelectronics and Solid State Devices · Vol. 9, Issue 1, 2022 · pp. 6–15 Read article
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Design of Voltage Controlled Oscillator using GDPK 90nm CMOS Technology
Abstract: In the recent decade, there has been a major revolution in communication systems and devices. Many communication devices required a specific frequency which may range from a few Hz to several GHz by source of voltage. Voltage Control Oscillator (VCO) plays a major role in today’s modern communication system. Voltage Control Oscillator use as basic building block in communication circuits and major use in phase locked loops circuits. Due to …
Published in Journal of Electronic Design Technology · Vol. 13, Issue 1, 2022 · pp. 17–24 Read article