Search
66 articles for “chip”
-
Custom Back-Side Illuminated Frame Transfer Charge Coupled Device (CCD): Chip Design and Electro-Optical Characterization
Abstract: This paper provides a comprehensive overview of the chip design and electro-optical characterization of a Charge Coupled Device (CCD). While CCD technology is well-established, there are limited research articles that offer holistic perspective of CCD chip development, covering aspects ranging from device architecture and chip layout design to characterization and optimization of electro-optical parameters. In this paper, we present CCD chip design and characterization of a custom 1200 x 256 …
Published in Journal of Semiconductor Devices and Circuits · Vol. 12, Issue 3, 2025 · pp. 39–55 Read article
-
Comparison of Index and Engineering properties of weak soils stabilized by Rubber Tyre Chips and Powder
Abstract: Engineered constructions on weak or soft ground soil carry inherent risks due to the instability of the foundation. Soft ground lacks the necessary strength to support structures adequately, making it prone to settlement, subsidence, or even collapse under the weight of buildings or infrastructure. Various methods of improvements are used to improve the soil's stability to support various loads.one of the solution is can use the waste products incorporated into …
Published in Journal of Polymer & Composites · Vol. 12, Issue 2, 2024 · pp. 24–33 Read article
-
How Microfluidics Are Used in Modern Science: Lab-on-A-Chip
Abstract: Microfluidics has changed modern research by making lab-on-a-chip (LOC) technologies that combine multiple lab functions into small, portable devices. These little platforms make it easier to correctly handle small amounts of fluid, which saves time, money, reagents, and automation. This article talks about microfluidics and how it helps LOC technology go forward in all areas of science. We look at important uses of biomedical diagnostics, drug development, environmental monitoring, and …
Published in International Journal of Advance in Molecular Engineering · Vol. 3, Issue 2, 2025 · pp. 35–48 Read article
-
Analysis of Steel Chip Fiber Reinforced Composite Dual Pile Under Lateral Load Conditions on Sloping Terrain
Abstract: Pile foundations, in addition to supporting vertical loads from superstructures, are subjected to lateral stresses arising from seismic activities, wind gusts, water currents, and traffic impacts etc. Failure to account for these lateral forces can pose significant risks if the structure is expected to encounter any form of lateral pressure. Previous research has investigated the behavior of individual composite piles under horizontal forces, considering different soil properties, to determine the …
Published in Journal of Polymer & Composites · Vol. 13, Issue 1, 2025 · pp. 210–220 Read article
-
A Physics-Informed Graph Neural Network Framework for Real- Time Thermal-Aware Fault Prediction and Adaptive Power Optimization in Heterogeneous System-on-Chip Architectures
Abstract: Heterogeneous System-on-Chip (SoC) architectures are increasingly adopted in edge computing, artificial intelligence, autonomous systems, and high-performance embedded platforms due to their superior computational efficiency and flexibility. However, increasing integration density and workload diversity introduce severe thermal hotspots, accelerated device degradation, and unexpected hardware faults that adversely affect system reliability and energy efficiency. This study proposes a Physics-Informed Graph Neural Network (PI-GNN) framework for real-time thermal- aware fault prediction and adaptive …
Published in Journal of VLSI Design Tools and Technology · Vol. 16, Issue 2, 2026 Read article
-
RTL-to-GDS Implementation of a High-Speed On-Chip 32:1 Serializer Using Open-Source Tools
Abstract: Exploring the RTL-to-GDS implementation of a high-speed on-chip 32:1 serializer, this study investigates the integration of open-source tools within VLSI design, emphasizing sustainable practices in the semiconductor industry while operating at the nanometer scale. Addressing methodologies for optimizing power consumption and chip area utilization, particularly focusing on efficient use of non-renewable resources. The study is set against the backdrop of advanced 7nm FinFET technology, critical for enabling efficient data transmission …
Published in Journal of VLSI Design Tools and Technology · Vol. 14, Issue 3, 2024 · pp. 1–10 Read article
-
Performance Analysis of Schmitt Trigger Circuit for Noise-Free Chips
Abstract: At lower nodes of complementary metal-oxide semiconductor (CMOS) technology, noise within a chip increase due to a drastic increment in interconnects within a given area. To improve the noise immunity of a chip, a Schmitt trigger circuit is used as a buffer instead of a simple CMOS inverter at various intervals along the metal interconnect. The use of a Schmitt trigger circuit not only makes the chip noise immune but …
Published in Journal of VLSI Design Tools and Technology · Vol. 14, Issue 3, 2024 · pp. 11–20 Read article
-
Advancing IoT Connectivity through Very Large-Scale Integration of Semiconductor Technology
Abstract: The term "integrated circuit" as it is currently used typically refers to a monolithic IC, which is significantly different from an HIC in that the former is created by joining several components on a substrate, while the latter is created in a sequence of steps using a single wafer that is subsequently divided into chips. Hybrid chips are perfect for complicated applications in sectors like artificial intelligence (AI), the Internet …
Published in Journal of Semiconductor Devices and Circuits · Vol. 11, Issue 3, 2024 · pp. 54–63 Read article
-
Physico-Mechanical Behavior of Euphorbia Abysinica and Wood Chips Composite
Abstract: In this study, we prepared composite test specimens from Eucalyptus chip particles of sizes 0.5 mm, 1 mm, and 2 mm combined with Euphorbia-Abyssinica fluid at an 80:20 mass ratio. We produced the particleboard under a compression load of 150 KN and kept it in the compression machine for thirty minutes inside the mold. After removing it from the machine, we secured it with C-clamps for twenty-four hours. We covered …
Published in Journal of Polymer & Composites · Vol. 14, Issue 4, 2026 Read article
-
Experimental Analysis of Cutting Forces Under Different Machining Parameters and Carbide Inserts During Turning of Hardened AISI 4340 Steel
Abstract: Turning of hardened materials with an advanced coated carbide insert has numerous advantages over the grinding process, e.g., reduced process cost, high material removal rate, and less environmental concern due to the elimination of the cutting fluid. Process parameters in conventional machining operations like cutting speed, feed, and depth of cut play the most crucial role behind the generation of heat which also leads to microstructural changes, improved tool life, …
Published in Journal of Polymer & Composites Read article
-
Influence of Cementitious and Aggregate Replacements on the Compressive Strength of Pervious Concrete
Abstract: Pervious concrete is a sustainable construction material designed to enhance stormwater management while maintaining adequate mechanical strength. This study investigates the compressive strength of pervious concrete cubes with various cementitious and coarse aggregate replacements. The research examines the effects of fly ash, silica fume, steel slag, and rubber chips on compressive strength at 7 and 28 days of curing. The results indicate that moderate fly ash replacement enhances compressive strength, …
Published in Journal of Construction Engineering, Technology & Management · Vol. 15, Issue 2, 2025 · pp. 9–14 Read article
-
New trends in Radio Frequency design and making things smaller
Abstract: Recent improvements in wireless communication, the Internet of Things (IoT), and 5G/6G networks have made people want small, powerful radio frequency (RF) equipment. With an emphasis on how developments in materials engineering, circuit architecture, and packaging technologies are redefining RF system integration, this article offers a thorough evaluation of current developments in RF downsizing. System-on-Chip (SoC), System-in-Package (SiP), and Antenna-in-Package (AiP) ideas, which allow tightly integrated RF front-ends with enhanced …
Published in International Journal of Radio Frequency Innovations · Vol. 3, Issue 2, 2025 · pp. 28–34 Read article
-
Next-Generation Semiconductors: Making AI, 5G, and More Possible
Abstract: The current digital environment is being reshaped by next-generation semiconductors, which are powering revolutionary technologies including enhanced computing systems, 5G connectivity, and artificial intelligence. Next-generation semiconductors are at the heart of new technologies that are changing the world we live in today, such as artificial intelligence (AI), 5G communication, and advanced computer systems. As traditional silicon-based designs reach their limits in terms of size and performance, new materials, architectures, and …
Published in Journal of Semiconductor Devices and Circuits · Vol. 13, Issue 1, 2026 Read article
-
Hybrid Quantum-Classical Reinforcement Learning Enabled Thermal-Aware Electronic Design Automation Framework for Energy-Efficient Next-Generation VLSI Systems Applications
Abstract: Modern Very Large-Scale Integration (VLSI) systems are becoming more complicated, which has increased need for sophisticated Electronic Design Automation (EDA) frameworks that can concurrently optimise thermal behaviour, power consumption, and performance. This study proposes a Hybrid Quantum-Classical Reinforcement Learning (HQCRL) Enabled Thermal-Aware EDA Framework for next-generation energy- efficient VLSI systems. The proposed framework integrates quantum-inspired optimization techniques with classical reinforcement learning algorithms to address the challenges of placement, routing, and …
Published in Journal of Electronic Design Technology · Vol. 17, Issue 2, 2026 Read article
-
Strengthening of Hydraulic Lime with Synthetic, Organic, and Bio-Additives: State-of-the-Art Review on Eco-Friendly Construction
Abstract: Cement is acknowledged to be one of the significant modern construction materials used all over the world because of its excellent properties. Though cement dominates the construction industry, the usage of lime binder is still replaceable because of the need for restoration and repair of existing heritage structures. Though lime offers several advantages such as “breathing”, higher durability and deformability, the performance of the lime mortar is still mistrusted because …
Published in Journal of Polymer & Composites · Vol. 11, Issue 1, 2023 · pp. 87–96 Read article
-
Multimodal Generative AI for Vehicular Applications at Edge
Abstract: This paper explores how the rapid advancements in vehicular technology, including autonomous driving and intelligent transportation systems, have driven the need for real-time data processing and decision-making. Multimodal generative AI, when deployed at the edge, offers a powerful solution for vehicular applications by leveraging diverse data sources such as video, audio, sensor inputs, and environmental data. This paper explores the integration of multimodal generative AI with edge computing in vehicular …
Published in Journal of Control & Instrumentation · Vol. 16, Issue 1, 2025 · pp. 27–34 Read article
-
Technometric Portrait of Sri Vinod Dham, an Indo-US Engineer, Father of Intel Pentium Process: A Quantitative Analysis
Abstract: Vinod Dham is recognized as the ‘Father of Pentium Chip’ or ‘Father of Intel Pentium Process’ in the field of the computer industry, and as an Indo-American pioneer from Silicon Valley. He has contributed 10 research papers during 1982–1986, with an average of two papers per year. This study tries to analyze his contributions through a bibliometric study and draw his familiarity as a world-famous electronic technologist. Data has been …
Published in Research & Reviews : Journal of Statistics · Vol. 14, Issue 3, 2025 · pp. 16–25 Read article
-
CFD Analysis of Six-Flow Microchannel Heat Sink Using the Different Nanofluid
Abstract: In this study, we compare the heat-conveying capabilities of ordinary water with those of cooling fluids such as Ag-Water, TiO2-water, and Al2O3-water nanofluid at a volume percentage of 0.50%, and we also examine the six flow micro-channels of the fin-equipped heat sink. Hardware like microprocessors and integrated circuits are not used in the comparison. To evaluate the effectiveness of different cooling fluids, a number of thermal metrics are used, such …
Published in Journal of Polymer & Composites · Vol. 11, Issue 11, 2023 · pp. 1–11 Read article
-
Evaluation of Antenna Performance using a Novel Measurement Device: Methodology and Results
Abstract: In the last decade, the field of On Chip Antennas (OCA) has experienced unprecedented growth due to the introduction of small, low-cost, low-power System-on-Chip (SoC) wireless communication devices. OCAs are superior to conventional off-chip antennas in a number of ways. They first reduce the overall size of the wireless communication system since the presence of an OCA eliminates the need for an impedance matching network between the antenna and RF …
Published in Journal of Telecommunication, Switching Systems and Networks · Vol. 11, Issue 1, 2024 · pp. 24–29 Read article
-
Nano-Enhanced Biosensors: Bridging the Gap in Early Disease Detection and Diagnosis
Abstract: This article provides an in-depth examination of nano-enhanced biosensors, a groundbreaking technology that combines nanotechnology and biosensing techniques to transform disease detection and diagnosis. These advanced sensors boast exceptional sensitivity, specificity, and rapid response times, enabling early detection and treatment of various medical conditions. The article covers the fundamental principles, current applications, and prospects of nano-enhanced biosensors in multiple medical domains, including recent research, experimental investigations, and case studies. It …
Published in Journal of Nanoscience, NanoEngineering & Applications · Vol. 14, Issue 2, 2024 · pp. 10–17 Read article