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7 articles for “circuit simulation and modelling”
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Modelling Electronic Diode Networks with PSPICE Simulation
Abstract: The dual of Thevenin, Norton equivalent circuit is used in place of any circuit/network of linear sources and immittances at at a given frequency. Both Thevenin with Norton theorem is useful for analyses and modification of circuits, to study /obtain network’s steady state response and initial condition. Methods to represent different circuits with Thevenin/Norton impedances connected at desired nodes are given using Spice/Pspice. The Thevenin/Norton impedances connected are of other …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 2, Issue 2, 2024 · pp. 17–37 Read article
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Comparison Analysis of Transformer Boosting and Induced Degeneration Topology Design of LNA for Millimeter Wave Frequency Range Using Polymeric Substrates
Abstract: In this study, a comparison between transformer boosting and source degeneration LNA topologies is conducted using two polymeric substrates—Polyimide (PI) and Liquid Crystal Polymer (LCP)—for millimeter-wave (mmWave) applications. With growing interest in flexible and high-frequency electronics, polymeric materials offer unique advantages such as low dielectric constants, mechanical flexibility, and thermal stability. The analysis explores gain, return loss, and noise figure performance while evaluating the influence of dielectric properties on the …
Published in International Journal of Electrical and Communication Engineering Technology · Vol. 3, Issue 2, 2025 · pp. 1–24 Read article
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Spintronic Logic Circuits for Ultrafast Processing
Abstract: Spintronic logic has emerged as one of the most promising post-CMOS paradigms capable of addressing the speed, density, and energy challenges of deeply scaled silicon technologies. By relying on the intrinsic properties of electron spin and magnetization dynamics, spintronic devices—particularly Magnetic Tunnel Junctions (MTJs), Spin-Transfer Torque (STT), and Spin–Orbit Torque (SOT) structures—enable ultrafast, non-volatile data processing with significantly reduced energy consumption. Despite remarkable device-level advancements, circuit- level realization of high-speed, …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 3, Issue 2, 2025 · pp. 35–43 Read article
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Inverse Model for Predicting Thermal Abnormality of the Transient Process Triggered by Defective Electronics Element
Abstract: The paper presents a model for predicting thermal abnormalities in Printed Circuit Boards (PCBs) by approximating the thermal process of electric elements with heating from point sources. Circuit board heat sources are defined as point and non-point. The point heat source is a small electronic heating element that can be approximated as having originated from one point on the circuit board. A non-point source is one with heat distributed over …
Published in International Journal of Energy and Thermal Applications · Vol. 3, Issue 2, 2025 · pp. 24–31 Read article
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Simulation and Experimental Analysis of Abuse Testing for Prediction of Life Cycle for Lithium Ion Battery Cell and Pack Level
Abstract: Lithium-ion batteries play a crucial role in contemporary technology, serving as the power source for everything from consumer gadgets to electric vehicles. However, their safety and longevity are significant influenced by the reperformance under extreme conditions, commonly referred to as ab use testing .This paper explores the simulation and analysis of ab use testing and life cycle prediction for lithium-ion batteries at both the cell and pack levels. Abuse testing …
Published in International Journal of Mechanical Dynamics and Systems Analysis · Vol. 2, Issue 2, 2024 · pp. 1–24 Read article
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Deep Learning-Based Thermal Prediction Models for Solid-State Electronic Devices
Abstract: The rapid advancement of solid-state electronic devices in high-performance computing, communication systems, automotive electronics, and renewable energy applications has significantly increased concerns related to thermal management and device reliability. Excessive heat generation in semiconductor devices adversely affects operational efficiency, switching performance, lifespan, and overall system stability. Traditional thermal prediction methods often require complex numerical computations and extensive simulation time, making them less suitable for real-time monitoring and adaptive control applications. …
Published in International Journal of Solid State Innovations & Research · Vol. 4, Issue 1, 2026 Read article
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Spintronic Logic Device Modeling and Energy Optimization for Beyond-CMOS Computing Systems
Abstract: The continuous scaling limitations of conventional CMOS technology have accelerated the exploration of alternative computing paradigms for next-generation low-power and high-performance systems. Spintronic logic devices have emerged as a promising solution due to their non-volatility, ultra-low switching energy, high integration density, and compatibility with beyond-CMOS architectures. This research presents a comprehensive modeling and energy optimization framework for spintronic logic devices applied in beyond- CMOS computing systems. The proposed work investigates …
Published in International Journal of VLSI Circuit Design & Technology · Vol. 4, Issue 1, 2026 Read article