Search
7 articles for “Solder”
-
Experimentally New Technique System to Measure Contact Angle of Metal/Melt System in Simple Way
Abstract: In this research, easy and new technique system to measure contact angle of metals/metals systemwas introduced. The new technique system used a simple component in direct procedure to foundcontact angle of solder on metals substrate in wide range of drops volumes. Solder was applied intoaluminum and copper substrate metals using control heating temperature of the substrate. Then, theresults were analyzed by image J program to know the accuracy of the …
Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 8, Issue 1, 2021 · pp. 38–43 Read article
-
Failed Component Image Acquisition Quality Optimization for Machine Vision System
Abstract: AbstractWith the rapid development of the global semiconductor industry, electronic products are required to have new ideas, diversified functions, and thinness and shortness. The ball grid array (BGA) packaging technique arranges solder balls in a matrix mode on the bottom of the component substrate, so as to increase the functional density. The dye stain test is extensively used for array component failure analysis; however, the operation takes time and extends …
Published in Current Trends in Signal Processing · Vol. 10, Issue 2, 2020 · pp. 17–25 Read article
-
Flip chip package to revive authenticated proclaim
Abstract: This article is described to access optimal manufacture process for flip-chip package. Method of electrical connection has subjected in flip chip to describe interlink of die to package carrier. Connection from die to exterior of package has thus, dealt by package carrier that has been either substrate or lead-frame. Interconnection between die and carrier has made using wire to subject standard package. Nevertheless, advanced technology nodal device fabrication has scriptive …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 28–33 Read article
-
Advanced Processing Technologies and Material Properties of Ceramic-Matrix Composites for Structural and Industrial Applications
Abstract: Ceramic-matrix composites (CMCs) are becoming more popular as building and industrial materials because they have a unique set of qualities, such as being able to withstand high temperatures and being light and strong. This brief talks about the newest improvements in processing methods and material features that have put CMCs at the top of the list of industrial materials. Using advanced processing methods like chemical vapor infiltration (CVI), polymer infiltration …
Published in Journal of Polymer & Composites · Vol. 12, Issue 6, 2024 · pp. 138–151 Read article
-
Automatic Headlight Level Detector
Abstract: This paper presents the work on the automatic headlight level detector system. The basic concept is to be able to devise a mechanism which automates the verification of headlight’s working, i.e., to check whether the headlight beam is able to cover the required angle. The paper presents the three major stages of the work: making the hardware which includes designing the circuit by soldering the components, and making the board …
Published in Journal of Electronic Design Technology · Vol. 4, Issue 3, 2013 · pp. 1–4 Read article
-
Efficient PCB Fault Detection System using Deep Learning and Image Processing
Abstract: Printed Circuit Boards (PCBs) are essential parts that support the operation of electronic equipment in a variety of sectors. Nevertheless, difficulties that manufacturers regularly face during the PCB manufacturing process lead to defective devices. However, current inspection processes occur after etching, wasting a lot of material and rendering defective PCBs unusable. This study discusses relevant practical difficulties and offers a method for identifying errors in real PCB images using Matlab …
Published in Journal of Nuclear Engineering & Technology · Vol. 13, Issue 3, 2023 · pp. 1–5 Read article
-
Design and Structural Analysis of Ground Electronic Package
Abstract: Electronic packaging (EP) is widely used for support and enclosure or housing of electronic component. This paper includes design of EP and comparisons of analytic and static structural analysis for deformation of EP. Design of EP is carried by commercial software PTC Creo Parametric 2.0. It consists of five main parts and some other additional parts and to run the analysis. The design includes mounting of electronic circuits; improving testing …
Published in Journal of Production Research & Management · Vol. 7, Issue 2, 2017 · pp. 8–16 Read article