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54 articles for “MOSFET devices.”
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Challenges Beyond 100 nm MOS Devices
Abstract: MOS devices have been aggressively scaled down in research and in the production in last few years. Sub-100 nm feature size MOS circuits have been used for many. However, many serious limitations and problems emerged with such a small geometry MOSFETs are used to realize very large-scale integrated circuits. Commercial 45 nm technology node, has much higher production cost and it is one of the greatest concern for scaling down …
Published in Journal of VLSI Design Tools and Technology · Vol. 6, Issue 2, 2016 · pp. 1–4 Read article
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A Study on Polymer-Based FinFET Applications and Logic Circuit Implementation with FinFET
Abstract: Nano devices play a crucial role in the semiconductor industry and can work as the solution for the problems like scaling of MOSFET. The FinFET can serve as the substitute of bulk CMOS in nanoscale. It mainly consists of two gate terminals which can be either shorted or kept independent.The shorted gate (SG-FinFET) configuration provides higher Ion and Ioff whereas the Independent Gate (IG-FinFET) configuration reduces the transistor count and …
Published in Journal of Polymer & Composites · Vol. 13, Issue 1, 2025 · pp. 312–340 Read article
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Simulation Study of Process Variations in Double Gate Junctionless Field-Effect Transistors
Abstract: This work discusses the process variations in symmetrical double-gate (DG) junctionless (JL) field-effect transistors (FETs) by device simulation. Output I-V characteristics along with subthreshold slope increase, DIBL variations with drain voltage and threshold voltage shift variations are systematically analyzed with the general variability issues including oxide thickness, channel thickness and doping concentration. Potential distribution in the body channel region is also analyzed. Optimum values of the variability factors are considered …
Published in Journal of Semiconductor Devices and Circuits · Vol. 2, Issue 2, 2015 · pp. 18–27 Read article
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Advanced Mathematical Modelling of Nanoscale Semiconductor Devices for Low-Power Microelectronic Applications
Abstract: With the ongoing scaling down of semiconductor devices, there is an increasing need for accurate mathematical models of electrostatic control, carrier transport, leakage current, and power consumption at the nanometer scale. As the sizes of semiconductors continue to decrease, there is a growing need for accurate mathematical models of electrostatic control, carrier transport, leakage current, and power consumption at the nanometer scale. In this work, a common mathematical modelling approach …
Published in Journal of Microelectronics and Solid State Devices · Vol. 13, Issue 2, 2026 Read article
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Comparative Analysis of MOSFET, CNTFET and NWFET for High Performance VLSI Circuit Design: A Review
Abstract: Nanowires are inimitable materials for considering phenomenon in nanoscale regime. Nanowires development exhibits ample of applications by controlling their, structure, composition as well as their electrical properties. This paper review diverse types of nanowires, nanowire field-effect transistor (NWFET) structure and their comparison with novel devices. Firstly, this paper describes different types of nanowires and nanowire heterostructure that shows nanowire heterostructures eliminates various factors that limit the performance of homogeneous nanowire …
Published in Journal of VLSI Design Tools and Technology · Vol. 6, Issue 2, 2016 · pp. 19–32 Read article
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Reduction of Short Channel Effects with the Variation of Poly Doping and Source/Drain Doping
Abstract: In this paper, the concentration of poly-silicon doping and source/drain doping has been varied to obtain the approximation the OFF state leakage current for N channel MOSFET. A lightly doped NMOS has been designed using 45 nm technology in ATHENA and simulated in ATLAS of SILVACO TCAD tool. After simulation results, it has been observed that as the poly-silicon doping and source drain doping concentrations are decreased, there is a …
Published in Journal of Semiconductor Devices and Circuits · Vol. 4, Issue 3, 2017 · pp. 35–42 Read article
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A Review on Tunnel Field Effect Transistor for Ambipolar Suppression, Higher ON Current and a Lower Subthreshold Swing
Abstract: Modern IC technology force on the ICs design considering more area optimization and low power techniques. We study herein the effect of hetero gate dielectric materials on the OFF-current (IOFF) and ON-current (ION) of the heterogate (high-k/low-k) tunnel field-effect transistor for which the simulations give significant improvements as compared to single-gate devices using an SiO2 gate dielectric. The ambipolar behavior is suppressed and radio frequency (RF) parameters are enhanced by …
Published in Journal of VLSI Design Tools and Technology · Vol. 8, Issue 2, 2018 · pp. 55–66 Read article
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A High Performance Reference Circuit with Optimized Input Offset Operational Amplifier using Device Mismatch Model
Abstract: In this paper, author describes a band gap reference (BGR) circuit, having reference voltage 1.20V with maximum temperature coefficient of 63 ppm/0C in temperature range of –40 to 120 0C. The circuit operates in range of supply voltage, 3.0V to 3.6V. An operational amplifier (op-amp), whose input offset voltage is reduced upto 892 µV using Pelgrom’s device mismatch model is used in BGR. The power supply rejection ratio of circuit …
Published in Journal of VLSI Design Tools and Technology · Vol. 3, Issue 1, 2013 · pp. 1–7 Read article
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Machine Learning Assisted Optimization of Nanoscale MOSFET Parameters Using TCAD Simulation
Abstract: This paper presents a machine learning (ML) assisted framework for the multi-objective optimization of nanoscale bulk n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs) with a 10 nm physical gate length, high-k HfO₂ gate dielectric, and TiN metal gate. Technology computer-aided design (TCAD) simulations employing drift-diffusion transport, Shockley-Read-Hall recombination, Lombardi mobility degradation, and density- gradient quantum correction models are used to generate a parametric dataset of 2,400 device configurations spanning gate length (L), …
Published in Journal of Microelectronics and Solid State Devices · Vol. 13, Issue 1, 2026 · pp. 10–19 Read article
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Suitability of Various Low Power Strategies for SRAM Design: A Survey
Abstract: In very high performance system on chip, static power dissipation plays a dominant role compared to dynamic component and it increases with technology scaling. Scaling of bulk MOSFET faces more and more challenges at 45 nm technology or below by producing short channel effect (SCE) which leads to increase in leakage current. An obstacle with bulk MOSFET at 45 nm or below gate length includes SCE, subthreshold leakage and gate …
Published in Journal of Semiconductor Devices and Circuits · Vol. 2, Issue 1, 2015 · pp. 6–13 Read article
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Simulation of Three Section Multilevel Inverter with Reduced Range of Switches
Abstract: Because of high generation development, the demand and excellent of electric strength ishigher than earlier than. Furthermore, due to the advancement of semiconductor, thespecification of electricity devices and strength conversion method turn out to be stricter. Oneof the energy converters that may remodel DC to AC is called inverter. An inverter is the intermedium to transmit the electricity to other electric device such as an uninterruptibleelectricity supply, servo motor, air-conditioner …
Published in Journal of VLSI Design Tools and Technology · Vol. 10, Issue 1, 2020 · pp. 15–36 Read article
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Implementation and Analysis of Full Adder using low Power Adiabatic Techniques
Abstract: AbstractIn this study, authors have discussed, designed and compared the low power adiabatic logic energy efficient recovery logic (ECRL) and positive feedback of adiabatic logic (PFAL) with conventional Complementary Mosfet (CMOS) logic. A one-bit full adder using these design techniques are implemented and results are compared like power, delay, transistor count and power delay product. Tanner tool v13 is used for designing of schematic and simulation. From the result, it …
Published in Journal of Semiconductor Devices and Circuits · Vol. 5, Issue 2, 2018 · pp. 1–8 Read article
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Modelling and Electrical Characterization of Single Electron Transistor
Abstract: A nano-electronic device with low power consumption, high performance, and quantum effects is the single electron transistor (SET). It's used in charge sensor applications, infrared radiation detectors, and spectroscopy. However, it faces limitations in lithography, co-tunneling effect, low gain, high output impedance, and background charges. Therefore, prior simulation is needed to optimize SET's work function and understanding physics concepts. A master equation approach is used to propose a new model …
Published in Journal of Semiconductor Devices and Circuits · Vol. 10, Issue 3, 2024 · pp. 19–25 Read article
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Design and Performance Analysis of Full Adder Cell using FinFET Technique at 32nm Technology
Abstract: AbstractIn this paper, discussed is the comparative analysis of complementary MOS (CMOS) and dual gate-FinFET (fin shaped field effect transistor) based full adder cell design. To reduce the average power, average current and maximum current of 1-bit full adder circuit a new high DG-FinFET technique is presented. Use of double-gate FinFET technology provides low leakage and high performance operation. For MOSFET transistor model, a predictive technology model (PTM) BSIM4 and …
Published in Journal of Microelectronics and Solid State Devices · Vol. 4, Issue 3, 2017 · pp. 1–8 Read article