Journal of Thin Films, Coating Science Technology & Application Review Article
Advances in Physical Vapour Deposition (PVD): Principles, Processes, Challenges, and Industrial Applications
This is an unedited manuscript accepted for publication and provided as an Article in Press for early access at the author’s request. The article will undergo copyediting, typesetting, and galley proof review before final publication. Please be aware that errors may be identified during production that could affect the content. All legal disclaimers of the journal apply.
Abstract
Physical Vapour Deposition (PVD) is widely used to produce thin films and protective coatings for applications where the surface properties of a material are as important as its bulk properties. The process involves converting a solid source material into vapour or energetic particles, transporting these species through a controlled environment, and depositing them onto a substrate to form a thin film. Over the years, improvements in PVD equipment and deposition techniques have made it possible to produce coatings with controlled composition, structure, thickness, and functional properties.
Several techniques are currently used in PVD, including thermal evaporation, electron-beam evaporation, magnetron sputtering, cathodic arc deposition, pulsed laser deposition, and ion plating. More recent developments, particularly high-power impulse magnetron sputtering (HiPIMS), reactive sputtering, and hybrid deposition systems, have extended the range of materials and coating structures that can be produced. These techniques are now used in the manufacture of hard protective coatings, corrosion-resistant surfaces, optical films, semiconductor components, transparent conductive layers, and other functional materials.
Despite these developments, obtaining coatings with consistently good adhesion, uniform thickness, low defect density, and suitable residual stress remains a challenge. Deposition costs, substrate temperature limitations, and difficulties associated with coating complex components also affect the wider industrial application of some PVD processes. This review discusses the basic principles of PVD, examines the main deposition techniques, and considers how processing conditions influence the structure and properties of deposited films. It also reviews applications in manufacturing, electronics, aerospace, automotive engineering, renewable energy, and biomedical technology. Particular attention is given to recent developments in multilayer coatings, nanostructured materials, high-entropy alloy films, process automation, and sustainable coating production. The review concludes by identifying areas where further research is needed to improve coating performance and make PVD processes more reliable and economical for industrial use.
Keywords
References (12)
- 1. Anders A. A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS). Surface and Coatings Technology. 2014 Oct 25;257:308-25.
- 2. Baptista A, Silva FJ, Porteiro J, Míguez JL, Pinto G, Fernandes L. On the physical vapour deposition (PVD): evolution of magnetron sputtering processes for industrial applications. Procedia Manufacturing. 2018 Jan 1;17:746-57.
- 3. Gudmundsson JT, Anders A, Von Keudell A. Foundations of physical vapor deposition with plasma assistance. Plasma sources science and technology. 2022 Aug 1;31(8):083001.
- 4. Lobe S, Bauer A, Uhlenbruck S, Fattakhova‐Rohlfing D. Physical vapor deposition in solid‐state battery development: from materials to devices. Advanced Science. 2021 Jun;8(11):2002044.
- 5. Mahan, J. E. (2000). Physical vapor deposition of thin films. John Wiley & Sons.
- 6. Mattox DM. Handbook of physical vapor deposition (PVD) processing. New York: William Andrew; 2010 Apr 29.
- 7. Ohring M. Materials science of thin films: depositon and structure. Academic press; 2002.
- 8. Sarakinos K, Alami J, Konstantinidis S. High power pulsed magnetron sputtering: A review on scientific and engineering state of the art. Surface and coatings technology. 2010 Feb 25;204(11):1661-84.
- 9. Thornton JA. Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings. Journal of Vacuum Science and Technology. 1974 Jul 1;11(4):666-70.
- 10. Thornton JA. High rate thick film growth. Annual review of materials science. 1977 Aug 21;7(1):239-60.
- 11. Vepřek S, Reiprich S. A concept for the design of novel superhard coatings. Thin solid films. 1995 Nov 1;268(1-2):64-71.
- 12. Colligon J, Vishnyakov V. Thin films: sputtering, PVD methods, and Applications. Surface and Interface Science: Volume 9: Applications of Surface Science I. 2020 Feb 10;9:1-55.