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Journal of Polymer & Composites Original Research Special issue

Development and Characterization of Pseudo-Elastic Ternary Cu-Al-Be Shape Memory Alloy and Its Scope as Shape Memory Hybrid Composites

  1. Dhanalaxmi Ananthula Department of Mechanical Engineering, Osmania University, Hyderabad
  2. K. Kishore Department of Mechanical Engineering, Vasavi College of Engineering, Hyderabad
  3. P. Usha Sri Department of Mechanical Engineering, Osmania University, Hyderabad
  4. Bala Narasimha Guniputi Department of Mechanical Engineering, Madanapalle Institute of Technology & Science, Madanapalle

Abstract

This research investigated the potential of the Cu-11.95Al-0.51Be shape memory alloy (SMA) for vibration damping applications. This specific composition of the alloy was selected to ensure the presence of the austenite phase (ß-phase) and to evaluate the pseudo-elastic (SE) behavior. This research explores the design, fabrication, and characterization of a pseudo-elastic ternary alloy. The key parameters examined in this study were the alloy phase and pseudo-elastic behavior. Other important factors, such as microstructure, transformation temperatures, and mechanical properties, were also thoroughly analyzed. Characterization techniques employed in this research include X-ray diffraction (XRD), optical microscopy (OM), differential scanning calorimetry (DSC), hardness test (VHN), uniaxial tensile test (UTM), and cyclic tensile tests. This research provides important insights into the potential of this SMA as a hybrid composite, contributing to the improved performance of composite materials. The composites that are embedded with SMAs can possess superior vibration damping capabilities. Results revealed that the ternary Cu-11.95Al-0.51Be SMA exhibits a pure austenite phase at room temperature, which is essential for pseudo-elastic behavior. The results also confirmed a good reversible martensitic transformation and pseudo-elastic behavior of the developed alloy, making it a promising candidate for vibration damping applications.

Keywords

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