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Studies of Tin Whisker Formation and Destruction
Abstract: This article contains whisker growth in current implements considered in electronics packaging. These surface relief growths are said contemporarily to prevent and save devices after Pb abatement. Vacancy flux at crack created from compressive stresses cause mass transfer to guide oxides for direct and control of whiskers. Logical subject to shift mass from equiax to migrating morphologies of equiax such as columns. Criteria from past theories for Sn whisker growth …
Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 7, Issue 3, 2020 · pp. 26–34 Read article