Tree fin array
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CFD Analysis of Tree Shaped Fin Array on Flat and Symmetrical Wedge Shaped Base Plate
Abstract: Heat generated from electronic chips is usually siphoned off by placing a heat sink. Due to the poor heat transfer capability of air extended surfaces are used as heat sink. Constant research is being carried out on the selection of geometry and material of extended surface for effective heat transfer. In the present work CFD analysis (ANSYS 14) is done on Tree fin array using FLUENT on a flat shaped …
Published in Journal of Thermal Engineering and Applications · Vol. 1, Issue 1, 2014 · pp. 1–6 Read article