Heat generated from electronic chips is usually siphoned off by placing a heat sink. Due to the poor heat transfer capability of air extended surfaces are used as heat sink. Constant research is being carried out on the selection of geometry and material of extended surface for effective heat transfer. In the present work CFD analysis (ANSYS 14) is done on Tree fin array using FLUENT on a flat shaped base and symmetrical wedge shaped base keeping the base temperature, volume of material and velocity of air constant. The array with symmetrical wedge shaped base is proved to have better heat dissipation rate.
