Energy-Efficient Integrated Circuits
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Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems
Abstract: The increasing complexity of next-generation embedded systems has intensified the challenges associated with power dissipation, thermal instability, signal integrity, and interconnect reliability in Very Large- Scale Integration (VLSI) architectures. This research proposes a thermally adaptive bio-inspired VLSI interconnect model designed to enhance communication efficiency and thermal resilience in advanced embedded platforms. The proposed model integrates bio-inspired adaptive routing principles with dynamic thermal-aware interconnect management to optimize data transmission under varying …
Published in Journal of VLSI Design Tools and Technology · Vol. 16, Issue 2, 2026 Read article