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3 articles for “Wire-arc additive manufacturing”
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Effect of Solution Heat Treatment and Aging on the tensile Properties of Ti-6Al-4V Alloy Component Manufactured by Wire Arc Additive Manufacturing
Abstract: Wire Arc Additive Manufacturing (WAAM) is a cost-effective technique for fabricating components from the Ti-6Al-4V alloy, known for its high strength and utility in demanding applications. To maximize its strength, the alloy undergoes Solution Treating and Aging heat treatment, comprising three key steps: (i) Solution Treating: The alloy is heated to 950°C (just below the β transus) and held for 1 hour, increasing the β phase proportion. This step sets …
Published in International Journal of Machine Systems and Manufacturing Technology · Vol. 3, Issue 2, 2025 · pp. 1–6 Read article
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Investigation of Robotic Transverse Twin-Wire GMAW for Large-Scale Wire-Arc Additive Manufacturing Applications
Abstract: Bulk metal additive manufacturing using wire-arc processes has gained significant attention for fabricating large-scale engineering components due to their high deposition rate and material efficiency. In this study, the feasibility and performance of robotic transverse twin-wire gas metal arc welding (GMAW) for bulk wire-arc additive manufacturing (WAAM) is systematically assessed. The research focuses on understanding arc stability, weld bead characteristics, and process–product relationships under high-deposition conditions. Welding current signals from …
Published in International Journal of Robotics and Automation in Mechanics · Vol. 4, Issue 1, 2026 · pp. 36–50 Read article
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New trends in Radio Frequency design and making things smaller
Abstract: Recent improvements in wireless communication, the Internet of Things (IoT), and 5G/6G networks have made people want small, powerful radio frequency (RF) equipment. With an emphasis on how developments in materials engineering, circuit architecture, and packaging technologies are redefining RF system integration, this article offers a thorough evaluation of current developments in RF downsizing. System-on-Chip (SoC), System-in-Package (SiP), and Antenna-in-Package (AiP) ideas, which allow tightly integrated RF front-ends with enhanced …
Published in International Journal of Radio Frequency Innovations · Vol. 3, Issue 2, 2025 · pp. 28–34 Read article