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2 articles for “PECVD”

• Published Subscription 22 Apr 2019

  Detailed Study On Physical Properties Of Silicon Nitride Films Deposited By Plasma Enhanced Chemical Vapour Deposition System

  By S. R. Yadhuraj, M. N. Talwar, T. K. Subramanyam

  Abstract: Amorphous silicon nitride films have been deposited by radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) technique using silane (SiH4) and ammonia (NH3) as source gases. Investigations have been made in detail to understand the influence of process parameters such as RF power, substrate temperature, gas flow ratio, working pressure etc, on the optical, electrical and surface properties in order to obtain dielectric Si3N4 films for semiconductor device applications. Amorphous …

  Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 3, Issue 1, 2016 · pp. 1–8 Read article →

• Published Subscription Original Research 28 Mar 2026

  Performance Enhancement of COC-Modified LLDPE Films: Optimization of Stiffness, Tear Resistance, and Barrier through Plasma Surface Modification

  By Hetal Shah, Purvi Dave, Sudhir Kumar Nema

  Abstract: This study explores the development of high-performance packaging materials by blending commodity Linear Low-Density Polyethylene (LLDPE) with engineering cyclic olefin copolymer (COC) as a performance modifier. To leverage the processability of LLDPE alongside the structural rigidity of COC, blends were prepared at various weight ratios (95/05, 90/10, 85/15, and 80/20) using twin-screw melt extrusion, followed by the production of films and sheets via blown film extrusion and compression molding. The …

  Published in Journal of Polymer & Composites · Vol. 14, Issue 2, 2026 · pp. 128–143 Read article →