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1 article for “Chemical mechanical polishing (CMP)”

• Published Subscription Original Research Special issue 14 Feb 2026

  Study of pH Behaviour of Slurry on Surface Morphology of Copper Material with Single Pole Magnetic Abrasive Finishing Process

  By Pravin Kumar Singh, Kheelraj Pandey, Anoop Kumar Sood, Ashwani Sharma

  Abstract: The chemical oxidizers—sodium hydroxide, Marshall’s acid salt, and hydrogen peroxide—were effectively employed in the wet polishing of copper using the SPMAF experimental setup. The manuscript explores preparation of slurry used for polishing copper material using single pole magnetic abrasive finishing (SPMAF) framework. The slurry contains distilled water, 1200-grit aluminum oxide abrasives, sodium hydroxide (NaOH), potassium persulfate (K₂S₂O₈), and hydrogen peroxide (H₂O₂), combined in precise amount. Specifically, 100 ml of distilled …

  Published in Journal of Polymer & Composites · Vol. 14, Issue 1, 2026 · pp. 1887–1896 Read article →