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2 articles for “Ball grid array”
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Flip chip package to revive authenticated proclaim
Abstract: This article is described to access optimal manufacture process for flip-chip package. Method of electrical connection has subjected in flip chip to describe interlink of die to package carrier. Connection from die to exterior of package has thus, dealt by package carrier that has been either substrate or lead-frame. Interconnection between die and carrier has made using wire to subject standard package. Nevertheless, advanced technology nodal device fabrication has scriptive …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 28–33 Read article
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Failed Component Image Acquisition Quality Optimization for Machine Vision System
Abstract: AbstractWith the rapid development of the global semiconductor industry, electronic products are required to have new ideas, diversified functions, and thinness and shortness. The ball grid array (BGA) packaging technique arranges solder balls in a matrix mode on the bottom of the component substrate, so as to increase the functional density. The dye stain test is extensively used for array component failure analysis; however, the operation takes time and extends …
Published in Current Trends in Signal Processing · Vol. 10, Issue 2, 2020 · pp. 17–25 Read article