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4 articles for “Al-Pb alloy”
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Comparison of microstructure and wear property of Al-30Pb alloy composite fabricated by spray forming and casting processes
Abstract: The influence of spray forming of Al-Pb alloy on its micro structure and wear behavior have been investigated. Aluminium alloys with lead 30%wt prepared via two methods viz. Casting and Spray casting process. The Al-Pb alloys are potential substances for bearing mixtures owing to the fact they possess most excellent performance like low price of production, friction properties, excessive non-corrosive effect, and excessive conductivity than different aluminum bearing alloys. Microstructural …
Published in Journal of Materials & Metallurgical Engineering · Vol. 9, Issue 1, 2019 · pp. 9–15 Read article
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Prevention of Corrosion in Electronic Articulated Forms
Abstract: This is study of typical corrosion failure in electronics arose from usual methods as galvanic corrosion, electrochemical migration, and bias induced corrosion. Common metals and alloys used in electronic devices are Al, Au, Cu, Ag, Sn, Pb and alloyed forms. Noble metal plated high performance electrical contacts have descriptive issues as high corrosion resistance thereby stable electrical behaviour. Films of metals and alloys constitutive to chip fabrication has detected to …
Published in Research and Reviews : Journal of Computational Biology · Vol. 10, Issue 1, 2021 Read article
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Development of Graphene Based Super Strong and Thermal Resistant High Nano Composite Materials
Abstract: The main goals of the research is to present the investigation in graphene based super strong and thermal resistant nano composite material and study their structural and mechanical properties after intensive severe plastic deformation. It is observed that the mechanical properties of graphene based super strong Nano composite materials show an intensive severe plastic deformation as accumulative roll bonding process was changed. Severe plastic deformation refined grains in the aluminium …
Published in Journal of Materials & Metallurgical Engineering · Vol. 10, Issue 2, 2020 · pp. 9–14 Read article
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Studies of Tin Whisker Formation and Destruction
Abstract: This article contains whisker growth in current implements considered in electronics packaging. These surface relief growths are said contemporarily to prevent and save devices after Pb abatement. Vacancy flux at crack created from compressive stresses cause mass transfer to guide oxides for direct and control of whiskers. Logical subject to shift mass from equiax to migrating morphologies of equiax such as columns. Criteria from past theories for Sn whisker growth …
Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 7, Issue 3, 2020 · pp. 26–34 Read article