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163 articles for “scalable system architecture”
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Advancing Conductive Ink Formulations for DIW with Graphene and Hybrid Nanostructures
Abstract: The development of solvent-based conductive inks for direct ink writing (DIW) has gained significant attention as a pathway toward flexible, wearable, and scalable electronic devices. This review critically examines conductive fillers, binders, solvent systems, and hybrid ink strategies reported in recent literature. Graphene and carbon nanotubes (CNTs) remain the most studied fillers due to their high intrinsic conductivity and unique dimensionality, but challenges such as restacking, bundling, and high viscosity …
Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 12, Issue 3, 2025 · pp. 36–49 Read article
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Machine Learning–Guided Cognitive RF System with Dynamic FFT Resolution and Multiplier Reconfiguration for Adaptive Anti-Jamming Communication
Abstract: This paper presents a hierarchical adaptive RF communication system that integrates signal quality-based pre- processing with machine learning-driven signal classification to achieve robust and resource-efficient operation in dynamic, interference-prone environments. Unlike prior art that addresses adaptive RF, ML classification, or anti-jamming individually, this work uniquely combines real-time SNR/RSSI-based signal strength estimation with dynamic FFT size selection (64-, 256- , or 512-point) and arithmetic-level multiplier reconfiguration (CORDIC, Distributed Arithmetic, and hybrid …
Published in International Journal of Radio Frequency Innovations · Vol. 4, Issue 1, 2026 Read article
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New trends in Radio Frequency design and making things smaller
Abstract: Recent improvements in wireless communication, the Internet of Things (IoT), and 5G/6G networks have made people want small, powerful radio frequency (RF) equipment. With an emphasis on how developments in materials engineering, circuit architecture, and packaging technologies are redefining RF system integration, this article offers a thorough evaluation of current developments in RF downsizing. System-on-Chip (SoC), System-in-Package (SiP), and Antenna-in-Package (AiP) ideas, which allow tightly integrated RF front-ends with enhanced …
Published in International Journal of Radio Frequency Innovations · Vol. 3, Issue 2, 2025 · pp. 28–34 Read article