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Journal of Thin Films, Coating Science Technology & Application Review Article

Advancing Conductive Ink Formulations for DIW with Graphene and Hybrid Nanostructures

  1. Jhunjhun Kumar Mishra School of Mech Engineering, Lovely Professional University
  2. Vishal Francis School of Mech Engineering, Lovely Professional University

Abstract

The development of solvent-based conductive inks for direct ink writing (DIW) has gained significant attention as a pathway toward flexible, wearable, and scalable electronic devices. This review critically examines conductive fillers, binders, solvent systems, and hybrid ink strategies reported in recent literature. Graphene and carbon nanotubes (CNTs) remain the most studied fillers due to their high intrinsic conductivity and unique dimensionality, but challenges such as restacking, bundling, and high viscosity necessitate dispersion control and optimized formulations. Binder materials play a decisive role in balancing dispersion stability with electrical performance: polyvinylpyrrolidone (PVP) consistently demonstrates superior stabilization at low concentrations compared to insulating binders such as polyvinyl alcohol (PVA) or brittle systems such as sodium silicate. Similarly, solvent selection is critical for DIW compatibility; ethanol-based systems require modification with ethylene glycol (EG) or terpineol to mitigate aggregation, suppress coffee-ring effects, and ensure rheological suitability. A key advancement highlighted in this review is the adoption of hybrid fillers, particularly graphene-CNT and graphene-Ag systems, which leverage synergistic conduction pathways to achieve conductivities in the range of 10³–10⁴ S/cm while maintaining flexibility. Literature consistently confirms that hybrid conductive inks, when stabilized with ≤3 wt% PVP in ethanol-EG or ethanol-terpineol blends, outperform single-filler systems in both conductivity and mechanical durability. Overall, hybrid architecture emerge as the most promising route for DIW-enabled printed electronics, providing a balance of printability, stability, and high electrical performance suitable for next-generation applications.

Keywords

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