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63 articles for “Heat input”
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Heat Stress Mitigation in Resource-Constrained Dairy Farming Systems: Practical Strategies for Sustainable Development
Abstract: Heat stress poses a critical threat to dairy production, particularly in resource-constrained systems prevalent across tropical and subtropical regions. Elevated ambient temperatures, compounded by high humidity, directly impair feed intake, milk yield, reproductive efficiency, and overall animal welfare. In low-resource settings, conventional cooling technologies such as automated fans, sprinklers, and climate-controlled housing remain economically inaccessible. Therefore, cost-effective, locally adaptable, and sustainable solutions are essential for maintaining productivity and animal health. …
Published in International Journal of Climate Conditions · Vol. 2, Issue 2, 2025 · pp. 1–12 Read article
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Thermosensitive and pH-Responsive Polymers for Smart Drug Delivery Systems
Abstract: Sensitive to temperature and pH, polymers are becoming a fascinating new class of material suitable for application in drug delivery systems. These polymers can be utilised in controlled release of medications as they change form depending on temperature and acidity. Thermosensitive polymers vary their formation and breakdown behaviour with temperature variations. They are therefore perfect for delivering pharmaceuticals to individuals as heat may be utilised to activate the medications at …
Published in Journal of Polymer & Composites · Vol. 13, Issue 4, 2025 · pp. 479–491 Read article
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Plasma Tweeter Loudspeaker - A Singing ARC
Abstract: Plasma arc speaker is a loudspeaker that generates sound without a solid diaphragm by varying the air pressure and utilizing a high voltage arc. It makes sound by heating air that causes air to expand in the same way as in thunderstorm. The grumbles and growls we hear in thunderstorm come from the quick expansion of the air surrounding the lightning bolt due to sudden increase in temperature. This produces …
Published in Journal of Microelectronics and Solid State Devices · Vol. 8, Issue 3, 2021 · pp. 26–35 Read article