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23 articles for “AI chips”
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Recent Trends and Techniques in the Advanced Microcontroller Bus Architecture (AMBA) Protocol: A Comprehensive Review
Abstract: ARM has created the Advanced Microcontroller Bus Architecture (AMBA) that is used as the main method for communication on chips in today’s embedded systems. Since AMBA is built to scale and combine with other components, it allows data transfer to high-performance and low-power components easily. The paper discusses how AMBA protocols have evolved and presents new trends of producing higher data rates, conserving energy, and lowering latency. This study offers …
Published in Recent Trends in Electronics Communication Systems · Vol. 12, Issue 3, 2025 · pp. 9–15 Read article
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Reusing Waste Plastics to Enhance Flexible Pavement Performance
Abstract: The disposal of plastic garbage Plastic products including cold drink bottles, carry bags, chocolate and chip wrappers, and all other types of plastic produce serious environmental and financial issues. These plastic types use a lot of energy and deplete the environment in a number of ways. Plastics are non-biodegradable, resulting in long-term environmental pollution and contributing to hazards such as microplastic contamination, marine debris, and threats to wildlife. Additionally, the …
Published in Journal of Polymer & Composites · Vol. 13, Issue 1, 2025 · pp. 173–183 Read article
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Optimizing Power Generation from Building Ventilation Systems: A Study on Exhaust Fan Efficiency
Abstract: Due to population growth, the world's energy consumption has increased dramatically in both wealthy and developing nations in recent years, and by 2042, it is predicted to have doubled or more. Since a few years ago, the use of innovative sustainable power sources to meet energy demands has been gradually increasing. We've chipped away at a different idea because of this. As an alternative energy source, renewable energy (RE) resources …
Published in International Journal of Electrical Power and Machine Systems · Vol. 1, Issue 2, 2023 · pp. 22–27 Read article