Journal of Electronic Design Technology
Volume 5, Issue 1 (2014)
Published
Table of contents
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VLSI Transistor and Interconnect Scaling Overview
Abstract: In this paper, various types of device and interconnect scaling used for VLSI transistors are mentioned. Advanced device scaling techniques using SOI & FINFET technology are discussed for nano-devices. New technologies adopted at research level are stated here in brief. Keywords: Scaling factor ‘s’, technology or process node, short-channel effects, draininduced barrier lowering, punch through, surface scattering, velocity saturation, impact ionization, hot electrons, SOI, floating body, FinFET, quantum dot cellular …
Published in Journal of Electronic Design Technology · Vol. 5, Issue 1, 2014 · pp. 1–15 Read article
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FDTD-based Time Domain Analysis of CMOS Gate Driven Interconnects
Abstract: Accurate time domain analysis of CMOS gate driven interconnects is important for the design and analysis of high performance VLSI systems. Conventionally, CMOS driver is approximated as a constant resistance instead of non-linear and time-varying MOS resistance, which causes inaccurate modeling of CMOS driver. This paper presents a new method for FDTD-based transient analysis of CMOS gate driven interconnect line using a generalized model. The generalized model of CMOS inverter …
Published in Journal of Electronic Design Technology · Vol. 5, Issue 1, 2014 · pp. 16–21 Read article
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Improvement of Design Issues in FinFET based Design Techniques for XOR and XNOR Circuits at 45 nm Technology
Abstract: The scaling of conventional CMOS circuit inclines to the short channel effect due to leakage current increase in the circuit. To minimize the short channel effect, FINFET can be used in place of conventional CMOS circuits. This paper demonstrates comparative performance study of high speed, low power and low voltage on XOR and XNOR digital circuit. This paper assesses and compares the performance of XOR and XNOR logic circuits. This …
Published in Journal of Electronic Design Technology · Vol. 5, Issue 1, 2014 · pp. 22–35 Read article
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Automization In Diamond Industry
Abstract: The rapidly increase in the technology in diamond industry makes it possible to cut, shape and polish diamond in the beautiful and artistic manner with less time consumption. But the process is very costly as extensive manpower is required in this technology. The various processes involved in this technology such as cutting into parts, polishing are done by the manpower. Above all the small things like to count the diamond …
Published in Journal of Electronic Design Technology · Vol. 5, Issue 1, 2014 · pp. 36–38 Read article
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Three Stage High Step-up Interleaved Boost Converter with Voltage Multiplier Cell
Abstract: In this paper, three stage high step-up interleaved boost converter with three voltage multiplier cells (VMCS) and three state switching cells (3SSC) is proposed. Here an interleaved boost converter is used, as a result higher efficiency and reduced input ripple current is obtained. Also, an additional stage of voltage multiplier i.e., three stages is added so that voltage gain will increase. It reduces switching loss and stress through the devices. …
Published in Journal of Electronic Design Technology · Vol. 5, Issue 1, 2014 · pp. 39–56 Read article