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Signal Integrity Analysis of Single Walled Carbon Nano Tube based Interconnects at 32 nm Technology NodeBy Purushottam Kumawat, Ashish Jha, Akansha Choudhary
Abstract: The rising demands for ultra-high-speed processors and portable devices have made the transistor and interconnect scaling a challenging issue in present days. In this work, the impedance parameter of copper and CNT based interconnects are calculated at 32 nm technology node for different lengths. The performances of CNT based interconnects are analyzed and compared with Cu based interconnects in terms of crosstalk. The conventional copper interconnects are not able to …
Published in Journal of Semiconductor Devices and Circuits · Vol. 5, Issue 1, 2018 · pp. 33–42 Read article →