heat dissipation
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The Next Era of Solid-State Innovation: Beyond Silicon
Abstract: The semiconductor industry is getting close to the physical and economic boundaries of silicon-based technology. A new era of solid-state innovation is beginning. Beyond Silicon: The Next Era of Solid-State Innovation looks at the materials, device layouts, and manufacturing methods that are about to change the way electronics and energy work. The article talks about improvements in wide- and ultra-wide-bandgap semiconductors, two- dimensional materials, and quantum and neuromorphic systems that …
Published in International Journal of Solid State Innovations & Research · Vol. 3, Issue 2, 2025 · pp. 19–23 Read article
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A Comprehensive Study of Radial Load Fluctuation on Alloy Wheels for Electric Vehicles
Abstract: Electric Vehicle’s alloy wheels are designed to allow for better heat dissipation. Manufacturers carry out many tests of a wheel to be sure, that the wheel will fit for safety reason as also their comfortability level is even bigger. Therefore, a specific design was selected for which the simulations of alloy wheel were performed under real loading conditions. The main objective of this research is to analyze the effects of …
Published in International Journal of Mechanical Dynamics and Systems Analysis · Vol. 2, Issue 2, 2024 · pp. 47–56 Read article
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Optimizing Fin Parameters to Enhance Passive Heat Dissipation in Photovoltaic Panels
Abstract: This study explores passive cooling techniques to enhance the thermal management of photovoltaic (PV) modules, which is crucial for maintaining efficiency. A computational fluid dynamics (CFD) model, using ANSYS Fluent, was developed to evaluate three fin shapes: rectangular, trapezoidal, and triangular, attached to the back of PV modules. The study varied parameters such as fin count, thickness, and length to determine optimal configurations for cooling. Among the designs, triangular fins …
Published in International Journal of Radio Frequency Innovations · Vol. 2, Issue 2, 2024 · pp. 25–35 Read article