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Development and Experimental Characterization of Metallic Spring Isolators for Electronic Packages of Air Borne Vehicles
Abstract: During flight, electronic packages in air borne vehicles will experience aerodynamic induced loads like random vibration and shock. PCBs mounted in these packages either malfunction or fail due to high vibration which is due to the stacked mounting of PCBs. Desired gap between any two adjacent PCBs will be maintained with the help of rigid spacers in this mounting. It is understood that the solution for reducing this high vibration …
Published in Journal of Experimental & Applied Mechanics · Vol. 7, Issue 2, 2016 · pp. 9–18 Read article