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3 articles for “finite element analysis-PCB”
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Development and Experimental Characterization of Metallic Spring Isolators for Electronic Packages of Air Borne Vehicles
Abstract: During flight, electronic packages in air borne vehicles will experience aerodynamic induced loads like random vibration and shock. PCBs mounted in these packages either malfunction or fail due to high vibration which is due to the stacked mounting of PCBs. Desired gap between any two adjacent PCBs will be maintained with the help of rigid spacers in this mounting. It is understood that the solution for reducing this high vibration …
Published in Journal of Experimental & Applied Mechanics · Vol. 7, Issue 2, 2016 · pp. 9–18 Read article
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Precise Modeling Practice for Avionics PCB in Random Vibration Environment
Abstract: Electronic packaging analysis fraternity makes use of finite element method (FEM) to predict random vibration response experienced by printed circuit board (PCB) of any avionics electronic package. Degree of accuracy associated with such prediction enables the connoisseur to make apt verdict while ascertaining the design adequacy of the package. Achieving accuracy in prediction is dictated by the preciseness associated with the modeling practices adopted in FEM. Precision of a particular …
Published in Journal of Experimental & Applied Mechanics · Vol. 7, Issue 1, 2016 · pp. 51–59 Read article
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Design and Development of Metallic Isolators for Wedge Lock Mounted Printed Circuit Boards (PCBs)
Abstract: Wedge lock interfaces are preferred for mounting printed circuit boards (PCBs) in electronic packages of air borne vehicles. Merits of this particular mounting configuration are high mounting stiffness, high vibration dissipation and low thermal interface resistance. However, good amount of vibration dissipation occurs only in the close vicinity of wedge locks provided integral to PCBs; because of which electronic components can be mounted only near the wedge locks on PCB. …
Published in Research & Reviews: A Journal of Embedded System & Applications · Vol. 4, Issue 3, 2016 · pp. 27–34 Read article