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1 article for “ImageJ Program”
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Experimentally New Technique System to Measure Contact Angle of Metal/Melt System in Simple Way
Abstract: In this research, easy and new technique system to measure contact angle of metals/metals systemwas introduced. The new technique system used a simple component in direct procedure to foundcontact angle of solder on metals substrate in wide range of drops volumes. Solder was applied intoaluminum and copper substrate metals using control heating temperature of the substrate. Then, theresults were analyzed by image J program to know the accuracy of the …
Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 8, Issue 1, 2021 · pp. 38–43 Read article