Journal of Semiconductor Devices and Circuits
Volume 8, Issue 2 (2021)
Published
Table of contents
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Design and Performance of Semiconductor-Biosensor
Abstract: In this work, a high electron mobility transistor (HEMT) based biosensor is designed to detect the virus-protein. In this work, all the simulation-studies are carried out in the SILVACO-ATLAS physical simulator using the following models: Shockley Read Hall (SRH), band gap narrowing, Auger recombination, and Fermi Dirac statistics. Newton trap numerical solver is used in the device simulation. Conduction band engineering of the biosensor is studied. DC and RF properties …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 1–13 Read article
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Comparative Study of Symmetric and Asymmetric Oxide Double Gate Junction less FET
Abstract: We carry out the performance of symmetric oxide (HfO2+HfO2) and asymmetric oxide (SiO2+HfO2) n-type junction less field-effect transistor (JLFET) based on two- dimensional Poisson equation. This study is accomplished by simulating a symmetric and asymmetric double gate JLFET on Sentaurus, Technology Computer Aided Design (TCAD) simulator for Silicon (Si) material at room temperature and varying temperature in between 300-360 k.Based on device simulation we find that the asymmetric oxide shows …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 14–20 Read article
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Design and Analysis of Hybrid System using Fuzzy Logic Controller
Abstract: The overall system is controlled by fuzzy logics. Load power consumes the power in sequence to solar power, wind power and the battery system power. Accordingly power delivered to the load. In the proposed framework, power is overseen or constrained by fluffy rationale regulators. The exhibition enhancement of half breed framework is examinations with sunlight based PV boards, wind turbine and the battery frameworks. The overall model & controlling strategies …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 21–27 Read article
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Flip chip package to revive authenticated proclaim
Abstract: This article is described to access optimal manufacture process for flip-chip package. Method of electrical connection has subjected in flip chip to describe interlink of die to package carrier. Connection from die to exterior of package has thus, dealt by package carrier that has been either substrate or lead-frame. Interconnection between die and carrier has made using wire to subject standard package. Nevertheless, advanced technology nodal device fabrication has scriptive …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 28–33 Read article
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ULTRAFAST LASERS AND ITS USE IN ELECTRONICS INDUSTRY
Abstract: The size of semiconductors and packaged devices continues to shrink enabling the devices to become more compact . This trend requires the deployment of sophisticated equipments with inbuilt lasers that have unique capability to process diverse materials with high precision , but without damaging the electronic components due to heat . There are diverse laser technologies utilising longer pulse width or ultrashort pulse (USP) width that are employed in electronic …
Published in Journal of Semiconductor Devices and Circuits · Vol. 8, Issue 2, 2021 · pp. 34–45 Read article