1 publication

• Published Subscription 9 Aug 2019

  Survey of System-on-Chip Modular Test Approach

  By harpreet vohra, amardeep singh

  Abstract: The advancement in semiconductor technology over the past few decades has enabled the industry to develop new design and reuse methodologies referred as System-on-chip (SoC) design. These typically integrate heterogeneous mix of various complex analog and digital cores, with all their necessary electronic circuitry. The recent advancements have led to the use of the 3D structures (3D-SOCs) that brought along the benefits of higher performance, minimum average interconnect length, reduced …

  Published in Journal of VLSI Design Tools and Technology · Vol. 6, Issue 3, 2016 · pp. 56–70 Read article →