1 publication

• Published Subscription 21 Apr 2016

  Fin-Set Materials Analysis for Heat Removal Utilizing ANSYS

  By Yogendra Singh Tomar, C.S. Kohli

  Abstract: Present paper deals with the effect of fin material on heat transfer from fin for electronics device cooling. Electronic tools discharge heat in the course of the work; that discharged heat should be removed either by passive or active ways. Current work stresses on passive (natural) way of cooling. Natural cooling can be done either by free air or fin. Different types of fin materials have been studied in the …

  Published in Journal of Advancements in Robotics · Vol. 3, Issue 1, 2016 · pp. 24–30 Read article →