Electronic packaging
2 articles · search the full text for this term
-
Evolution of Structural Dynamic Modeling Technique for Airborne Chassis
Abstract: To estimate random vibration response of airborne chassis finite element method is used as a tool. For making an appropriate requirement to determine the design requirement of the package for a designer the point of accuracy is very much linked to this prophecy. The modeling practices which are used in FEM are linked to attain preciseness in any considered prediction. Preciseness of a particular FE model is inclined with appropriate …
Published in Journal of Mechatronics and Automation · Vol. 3, Issue 3, 2016 · pp. 12–17 Read article
-
Prevention of Corrosion in Electronic Articulated Forms
Abstract: This is study of typical corrosion failure in electronics arose from usual methods as galvanic corrosion, electrochemical migration, and bias induced corrosion. Common metals and alloys used in electronic devices are Al, Au, Cu, Ag, Sn, Pb and alloyed forms. Noble metal plated high performance electrical contacts have descriptive issues as high corrosion resistance thereby stable electrical behaviour. Films of metals and alloys constitutive to chip fabrication has detected to …
Published in Research and Reviews : Journal of Computational Biology · Vol. 10, Issue 1, 2021 Read article