Cupper
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Experimentally New Technique System to Measure Contact Angle of Metal/Melt System in Simple Way
Abstract: In this research, easy and new technique system to measure contact angle of metals/metals systemwas introduced. The new technique system used a simple component in direct procedure to foundcontact angle of solder on metals substrate in wide range of drops volumes. Solder was applied intoaluminum and copper substrate metals using control heating temperature of the substrate. Then, theresults were analyzed by image J program to know the accuracy of the …
Published in Journal of Thin Films, Coating Science Technology & Application · Vol. 8, Issue 1, 2021 · pp. 38–43 Read article
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ANN Controlled Plasma Spray Process by using Industrial Waste
Abstract: Plasma spray coating process has become a subject of intense research because it becomes an affordable solution for many industrial applications. The present work aims at developing and studying the industrial wastes (Flay-ash powder mixture) as the coating material, which is to be deposited on Mild Steel and Cupper substrates. To increase the coating deposition efficiency and to decrease the cost of coating process, one of the artificial intelligence (AI) …
Published in Journal of Materials & Metallurgical Engineering · Vol. 3, Issue 3, 2013 · pp. 1–6 Read article