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2 articles for “PCB boundary conditions”

• Published Subscription 25 Apr 2016

  Precise Modeling Practice for Avionics PCB in Random Vibration Environment

  By K. Jagadisan, P. Bangaru Babu, P. Anil Kumar

  Abstract: Electronic packaging analysis fraternity makes use of finite element method (FEM) to predict random vibration response experienced by printed circuit board (PCB) of any avionics electronic package. Degree of accuracy associated with such prediction enables the connoisseur to make apt verdict while ascertaining the design adequacy of the package. Achieving accuracy in prediction is dictated by the preciseness associated with the modeling practices adopted in FEM. Precision of a particular …

  Published in Journal of Experimental & Applied Mechanics · Vol. 7, Issue 1, 2016 · pp. 51–59 Read article →

• Published Subscription 9 Jan 2017

  Design and Development of Metallic Isolators for Wedge Lock Mounted Printed Circuit Boards (PCBs)

  By P. Anil Kumar, P. Bangaru Babu

  Abstract: Wedge lock interfaces are preferred for mounting printed circuit boards (PCBs) in electronic packages of air borne vehicles. Merits of this particular mounting configuration are high mounting stiffness, high vibration dissipation and low thermal interface resistance. However, good amount of vibration dissipation occurs only in the close vicinity of wedge locks provided integral to PCBs; because of which electronic components can be mounted only near the wedge locks on PCB. …

  Published in Research & Reviews: A Journal of Embedded System & Applications · Vol. 4, Issue 3, 2016 · pp. 27–34 Read article →