1 publication

• Published Subscription 8 Sep 2016

  3D-IC Partitioning and TSV Sharing Optimization Algorithm

  By M. Sarojini, D. Gracia Nirmala Rani

  Abstract: Recent technologies are in need of shorter vertical interconnects, thus forcing the integration technology from 2D to 3D. Because more than 50% of dynamic power consumption is due to interconnects. As a solution, 3D integration consists of stacking integrated circuits and connecting them with short vertical interconnects. TSV is used to vertically connect the hardware components in different dies stacked in 3D ICs. But in floor planning TSVs are very …

  Published in Journal of Multimedia Technology & Recent Advancements · Vol. 3, Issue 2, 2016 · pp. 6–10 Read article →