1 publication

• Published Subscription 25 Sep 2020

  Failed Component Image Acquisition Quality Optimization for Machine Vision System

  By Chien-Yi Huang, Poi-Jhih Wang

  Abstract: AbstractWith the rapid development of the global semiconductor industry, electronic products are required to have new ideas, diversified functions, and thinness and shortness. The ball grid array (BGA) packaging technique arranges solder balls in a matrix mode on the bottom of the component substrate, so as to increase the functional density. The dye stain test is extensively used for array component failure analysis; however, the operation takes time and extends …

  Published in Current Trends in Signal Processing · Vol. 10, Issue 2, 2020 · pp. 17–25 Read article →