1 publication

• Published Subscription 4 Feb 2017

  Design and Structural Analysis of Ground Electronic Package

  By Rajan Chavda, Sarang Pande, Anurag Verma

  Abstract: Electronic packaging (EP) is widely used for support and enclosure or housing of electronic component. This paper includes design of EP and comparisons of analytic and static structural analysis for deformation of EP. Design of EP is carried by commercial software PTC Creo Parametric 2.0. It consists of five main parts and some other additional parts and to run the analysis. The design includes mounting of electronic circuits; improving testing …

  Published in Journal of Production Research & Management · Vol. 7, Issue 2, 2017 · pp. 8–16 Read article →